COMPOSITION FOR SEMICONDUCTOR CHIP PROTECTION BUFFER COATING MATERIAL, FILM FOR SEMICONDUCTOR CHIP PROTECTION BUFFER COAT ARRANGED BY USE THEREOF, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE

• Main Authors: HAMA MASAYUKI, NOMURA YUTAKA, WATASE YUSUKE
• Format: Patent
• Language: English; Japanese
• Published: 16.01.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide: a composition for a semiconductor chip protection buffer coating material to form a resin layer for protection on an electronic component package outermost layer, and to suppress a flash or break of a semiconductor chip sealing resin under a high-dicing speed condition; a film for semiconductor chip protection buffer coat, which is arranged by use of the composition; and a method for manufacturing an electronic component package.SOLUTION: A composition for semiconductor chip protection buffer coating material comprises (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler and (D) rubber particles. The inorganic filler (C) has a volume-average particle diameter of 0.1-15 μm.SELECTED DRAWING: None 【課題】保護用樹脂層を電子部品パッケージ最外層に形成し、ダイシングスピードの速い条件下で、半導体チップ封止樹脂のバリ、欠けを低減するための、半導体チップ保護バッファーコート材用組成物、それを用いた半導体チップ保護バッファーコート用フィルムと電子部品パッケージの製造方法を提供する。【解決手段】 （Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）無機フィラー及び（Ｄ）ゴム粒子を含有し、前記（Ｃ）無機フィラーの体積平均粒子径が、０．１〜１５μｍである半導体チップ保護バッファーコート材用組成物。【選択図】なし