CONDUCTIVE COMPOSITION AND CONDUCTIVE FILM
To provide a conductive film having high flexibility, and to provide a conductive composition with which the conductive film having high flexibility can be formed with a free pattern by a simple method.SOLUTION: A conductive composition includes conductive fine particles and a polymeric resin and fu...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
16.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a conductive film having high flexibility, and to provide a conductive composition with which the conductive film having high flexibility can be formed with a free pattern by a simple method.SOLUTION: A conductive composition includes conductive fine particles and a polymeric resin and further includes conductive fiber having fiber length of 500-3,000 μm. In addition, a conductive film includes the conductive fine particles, the polymeric resin and the conductive fiber having fiber length of 500-3,000 μm. It is preferable that thickness of the conductive fiber is 10-50 μm and the conductive fiber is organic fiber having a metallic film on the surface.SELECTED DRAWING: Figure 1
【課題】高度の耐屈曲性を有する導電膜を提供すること。簡易な方法によって自由なパターンで、高度の耐屈曲性を有する導電膜を形成可能な、導電性組成物を提供すること。【解決手段】導電性微粒子と高分子樹脂とを含有し、更に、繊維長が500〜3,000μmである導電性繊維を含有していることを特徴とする導電性組成物である。また、導電性微粒子と高分子樹脂と繊維長が500〜3,000μmである導電性繊維とを含有していることを特徴とする導電膜である。前記導電性繊維の太さが10〜50μmであること、前記導電性繊維が表面に金属皮膜を有する有機繊維であることが好ましい。【選択図】 図1 |
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Bibliography: | Application Number: JP20180128968 |