LASER PROCESSING DEVICE

• Main Authors: FUKUOKA HIROTAKE, KONDO YUTA
• Format: Patent
• Language: English; Japanese
• Published: 16.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a laser processing device that can expand a range in which autofocus processing can be performed, with a more simple structure.SOLUTION: A laser processing device 200 comprises: a light collection optical system 204 that collects laser light L to form a first light collection point P1 and collects laser light LB1 for AF to form a second light collection point P2; a reflection type space light modulator 203 that modulates the laser light L according to a modulation pattern, between a laser light source 202 of the laser light L and the light collection optical system 204; and a control part 250 that controls a modulation pattern to be presented to the reflection type space light modulator 203. The control part 250 allows a modulation pattern including the light collection position change pattern for changing a position of the first light collection point P1 to be presented on the reflection type space light modulator 203, according to a distance L12 between the first light collection point P1 and the second light collection point P2 and a processing depth D1 of laser processing from a surface 3.SELECTED DRAWING: Figure 15 【課題】より簡単な構成によって、オートフォーカス加工が可能な範囲を拡大できるレーザ加工装置を提供する。【解決手段】レーザ加工装置２００は、レーザ光Ｌを集光して第１集光点Ｐ１を形成すると共にＡＦ用レーザ光ＬＢ１を集光して第２集光点Ｐ２を形成する集光光学系２０４と、レーザ光Ｌのレーザ光源２０２と集光光学系２０４との間において、変調パターンに応じてレーザ光Ｌを変調するための反射型空間光変調器２０３と、反射型空間光変調器２０３に提示する変調パターンを制御する制御部２５０と、を備える。制御部２５０は、第１集光点Ｐ１と第２集光点Ｐ２との間の距離Ｌ１２、及び、表面３からのレーザ加工の加工深さＤ１さに応じて、第１集光点Ｐ１の位置を変更するための集光位置変更パターンを含む変調パターンを反射型空間光変調器２０３に提示させる。【選択図】図１５