LAMINATED UNCURED SHEET
To provide a laminated uncured sheet with which a wiring board excellent in electrical reliability can be obtained.SOLUTION: A laminated uncured sheet 1 has a structure in which resin sheet layers 2 and resin layers 3 are alternately laminated and is formed with through-holes 4 penetrating in a lami...
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Main Authors | , , , , |
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Format | Patent |
Language | English Japanese |
Published |
09.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a laminated uncured sheet with which a wiring board excellent in electrical reliability can be obtained.SOLUTION: A laminated uncured sheet 1 has a structure in which resin sheet layers 2 and resin layers 3 are alternately laminated and is formed with through-holes 4 penetrating in a lamination direction. The resin sheet layers are formed of a thermosetting resin composition containing a thermosetting resin as a main component. The resin layers are formed of a thermoplastic resin composition containing a thermoplastic resin. The thermoplastic resin composition 31 is attached to an inner wall surface 5 of the resin sheet layer portion in the through-hole.SELECTED DRAWING: Figure 1
【課題】電気的信頼性に優れた配線基板が得られる積層未硬化シートを提供する。【解決手段】積層未硬化シート1は、樹脂シート層2と樹脂層3とが交互に積層され、積層方向に貫通する貫通孔4が形成された構造を有する。樹脂シート層は、熱硬化性樹脂を主成分とする熱硬化性樹脂組成物で形成される。樹脂層は、熱可塑性樹脂を含む熱可塑性樹脂組成物で形成される。貫通孔における樹脂シート層部分の内壁面5に熱可塑性樹脂組成物31が付着している。【選択図】図1 |
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Bibliography: | Application Number: JP20180123234 |