MODULAR VALVE WITH O-RING VALVE SEAT

To provide a solenoid operated valve having a structure that can be used even if a fluid flowing through the solenoid operated valve has corrosiveness to a bond or an adhesive which fixes an elastomer material to a valve member.SOLUTION: A solenoid operated modular valve 20 includes a valve body 22,...

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Bibliographic Details
Main Authors NEFF MATTHEW, SIMMONDS JEFFREY, BRETT ANTHONY LANDACRE
Format Patent
LanguageEnglish
Japanese
Published 09.01.2020
Subjects
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Summary:To provide a solenoid operated valve having a structure that can be used even if a fluid flowing through the solenoid operated valve has corrosiveness to a bond or an adhesive which fixes an elastomer material to a valve member.SOLUTION: A solenoid operated modular valve 20 includes a valve body 22, a valve member 24 slidingly received in the valve body 22, and a solenoid 26 that moves the valve member 24 between an open position and a closed position. The valve body 22 has an end face 30, a side face 32, and an inner bore 34. An outlet port 36 in the end face 30 is disposed in fluid communication with the inner bore 34. An inlet port 38 in the side face 32 is disposed in fluid communication with the inner bore 34. The valve body 22 includes an O-ring valve seat 102 that is positioned longitudinally between the inner bore 34 and the outlet port 36. The valve member 24 includes a tapered end 108 that has a frustoconical shape and a valve member abutment surface 110. The valve member abutment surface 110 contacts the O-ring valve seat 102 when the valve member 24 is in the closed position.SELECTED DRAWING: Figure 2 【課題】電磁弁を流れる流体が、エラストマー材料をバルブ部材に固定する接合剤または接着剤に対して腐食性がある場合でも使用できる構成の電磁弁を提供する。【解決手段】電磁モジュラーバルブ20は、バルブ本体22と、バルブ本体22に摺動可能に収容されるバルブ部材24と、開位置と閉位置の間を移動させるソレノイド26とを備える。バルブ本体22は、端面30、側面32および内部孔34を有する。端面30の流出口36は、内部孔34と流体連通して設けられる。側面32の流入口38は、内部孔34と流体連通して設けられる。バルブ本体22は、長手方向において内部孔34と流出口36の間に配置されるOリング弁座102を備える。バルブ部材24は、円錐台形状のテーパー端部108、およびバルブ部材当接面110を有する。バルブ部材当接面110は、バルブ部材24が閉位置にある時、Oリング弁座102と当接する。【選択図】図2
Bibliography:Application Number: JP20190075236