SPUTTERING DEVICE

• Main Authors: WATANABE NAOKI, TAKEI JUNICHI, SUZUKI NAOYUKI, SONE HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 09.01.2020
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a technology capable of suppressing heat deformation of a slit plate.SOLUTION: A sputtering device in an embodiment has a treatment vessel for storing a substrate, a slit plate arranged in parallel with the surface of the substrate over the substrate in the treatment vessel, and a heat-re...