SPUTTERING DEVICE

• Main Authors: WATANABE NAOKI, TAKEI JUNICHI, SUZUKI NAOYUKI, SONE HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 09.01.2020
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a technology capable of suppressing heat deformation of a slit plate.SOLUTION: A sputtering device in an embodiment has a treatment vessel for storing a substrate, a slit plate arranged in parallel with the surface of the substrate over the substrate in the treatment vessel, and a heat-receiving plate placed on the slit plate under a target material provided inclinedly to the slit plate, and formed of a material having higher heat resistance than the slit plate.SELECTED DRAWING: Figure 1 【課題】スリット板の熱変形を抑制することができる技術を提供する。【解決手段】本開示の一態様によるスパッタ装置は、基板を収容する処理容器と、前記処理容器内の前記基板の上方に前記基板の表面と平行に配置され、板厚方向に貫通する開口部を有するスリット板と、前記スリット板に対して傾斜させて設けられるターゲット材の下方において前記スリット板の上に載置され、前記スリット板よりも耐熱性が高い材料により形成された熱受け用プレートと、を有する。【選択図】図１