SIP MODULE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: CAO JING, LING DONG-FENG, MONG WENG-KHOON
• Format: Patent
• Language: English; Japanese
• Published: 26.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a method of manufacturing a SiP module having an electromagnetic shield protective function in a plurality of wavelength regions.SOLUTION: A method of manufacturing a system in package (SiP) module includes: welding electronic elements required by the SiP module onto a top surface of a pr...