SIP MODULE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: CAO JING, LING DONG-FENG, MONG WENG-KHOON
• Format: Patent
• Language: English; Japanese
• Published: 26.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a method of manufacturing a SiP module having an electromagnetic shield protective function in a plurality of wavelength regions.SOLUTION: A method of manufacturing a system in package (SiP) module includes: welding electronic elements required by the SiP module onto a top surface of a printed circuit board with welding spots being reserved on a bottom surface of the printed circuit board, to create a printed circuit board device of the SiP module; pasting tightly a functional film on a surface of the electronic elements on the printed circuit board device; filling and sealing plastic material on a top surface of the printed circuit board device, covering the electronic elements and the functional film on the top surface of the printed circuit board device with the plastic material, and obtaining the cured printed circuit board device after the plastic material is cured; and cutting the cured printed circuit board device to obtain the plurality of SiP modules.SELECTED DRAWING: Figure 1 【課題】複数の波長域の電磁遮蔽保護機能を備えるＳｉＰモジュールの製造方法を提供する。【解決手段】下面に溶接点が予め準備されたプリント回路板の上面に、ＳｉＰモジュールに必要となる電子素子を溶接し、ＳｉＰモジュールのプリント回路板デバイスを作成するステップと、プリント回路板デバイスにおける上記電子素子の表面に機能性フィルムを強固に貼り付けるステップと、プリント回路板デバイスの上面にプラスチック材を充填して封止し、プラスチック材によってプリント回路板デバイス上面での電子素子及び機能性フィルムを覆い、プラスチック材を硬化させた後、硬化されたプリント回路板デバイスを得るステップと、硬化されたプリント回路板デバイスをカットし、複数の上記ＳｉＰモジュールを得るステップとを含む。【選択図】図１