SOLDER BALL MOUNTING DEVICE AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT DEVICE

To provide a solder ball mounting device capable of preventing deformation of a solder ball and damage to an electronic circuit board.SOLUTION: A solder ball mounting device 1 comprises a first head portion 33 and a load sensor 17. The first head portion 33 includes a first solder ball holding unit...

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Bibliographic Details
Main Authors MURATA TAKANORI, TOZAKI HIDEFUMI
Format Patent
LanguageEnglish
Japanese
Published 26.12.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a solder ball mounting device capable of preventing deformation of a solder ball and damage to an electronic circuit board.SOLUTION: A solder ball mounting device 1 comprises a first head portion 33 and a load sensor 17. The first head portion 33 includes a first solder ball holding unit 40 and a first pin 48. The load sensor 17 is configured to detect a load applied from the first head portion 33 to an electronic circuit board 15 on which a solder ball 30 is mounted. When the load increases to a first threshold, further movement of the first pin 48 toward the electronic circuit board 15 is stopped.SELECTED DRAWING: Figure 2 【課題】はんだボールの変形及び電子回路基板の破損を防ぐことができるはんだボール搭載装置を提供する。【解決手段】はんだボール搭載装置１は、第１ヘッド部３３と、荷重センサ１７とを備える。第１ヘッド部３３は、第１はんだボール保持部４０と、第１ピン４８とを含む。荷重センサ１７は、第１ヘッド部３３からはんだボール３０が搭載される電子回路基板１５に印加される荷重を検出するように構成されている。荷重が第１閾値に増加したときに、電子回路基板１５に向けた第１ピン４８のさらなる移動を停止する。【選択図】図２
Bibliography:Application Number: JP20180118838