COATING FILM FORMING METHOD AND COATING FILM FORMING APPARATUS

• Main Author: KAMITO SHINGO
• Format: Patent
• Language: English; Japanese
• Published: 26.12.2019
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

To provide a technique for flattening the surface of a coating film formed on the entire surface of a substrate having a pattern having a step on the surface.SOLUTION: A coating film forming method includes a coating film forming step of forming a coating film by supplying a coating liquid to the entire surface of a substrate having a pattern having a step on the surface, a pressing step of relatively pressing the flat surface against the coating film of the substrate by a pressing unit having a flat surface covering the entire surface of the substrate held by a first holding unit, and a coating film curing step of curing the coating film having a flattened surface.SELECTED DRAWING: Figure 3 【課題】表面に段差を備えたパターンを有する基板の表面全体に形成された塗布膜の表面を平坦化する技術を提供すること。【解決手段】段差を備えたパターンを表面に有する基板の当該表面全体に塗布液を供給して塗布膜を形成する塗布膜形成工程と、第１の保持部に保持された前記基板の表面全体を被覆する平坦面を備えたプレス部により、前記基板の塗布膜に対して前記平坦面を相対的に押し当てるプレス工程と、表面が平坦化された前記塗布膜を硬化させる塗布膜硬化工程と、を含むことを特徴とする。【選択図】図３