COMPOUND, MANUFACTURING METHOD OF COMPOUND, AND COMPOSITION FOR ORGANIC FILM FORMATION

To provide a compound which is cured under a deposition condition not only in air, but also in inert gas, generates no by-product, and can form an organic underlay film not only excellent in heat resistance or impregnation or flattening property of pattern formed on a substrate, but also good in dry...

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Main Authors WATANABE TAKESHI, DANIEL PAUL SANDERS, SAWAMURA TAKASHI, OGIWARA TSUTOMU, ARAIDA KEISUKE, GREGORY BREYTA, RUDY J WOJTECKI, NAGAI YOKO, ALEXANDER EDWARD HESS, TACHIBANA SEIICHIRO
Format Patent
LanguageEnglish
Japanese
Published 26.12.2019
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Summary:To provide a compound which is cured under a deposition condition not only in air, but also in inert gas, generates no by-product, and can form an organic underlay film not only excellent in heat resistance or impregnation or flattening property of pattern formed on a substrate, but also good in dry etching resistance during substrate processing, a manufacturing method of the compound, and a composition for organic film formation using the compound.SOLUTION: There is provided a compound represented by, for example, the following formula (A2).SELECTED DRAWING: Figure 1 【課題】空気中のみならず、不活性ガス中での成膜条件でも硬化し、副生物が発生せず、耐熱性や、基板上に形成されたパターンの埋め込みや平坦化特性に優れるだけでなく、基板加工時のドライエッチング耐性も良好な有機下層膜を形成できる化合物、該化合物の製造方法、及び該化合物を用いた有機膜形成用組成物を提供する。【解決手段】下記式(A2)などで示される化合物。【選択図】図1
Bibliography:Application Number: JP20190102009