PROCESSING DEVICE ADJUSTMENT METHOD AND PROCESSING DEVICE

• Main Authors: YARIMITSU MASAKAZU, SAKAMOTO TAKAHIRO, TATSU SHUJIRO, FUKUNAGA NOBUTAKA
• Format: Patent
• Language: English; Japanese
• Published: 19.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To suitably adjust plural chucks, which hold a substrate, in a processing device for processing the substrate.SOLUTION: A method for adjustment of a processing device which comprises plural chucks and processes a substrate held by the chucks has: a height measurement process in which heights of surfaces of the plural chucks are measured; a reference selection process in which a reference chuck is selected from the plural chucks; a target setting process in which on the basis of the measurement result in the height measurement process, a target height of a surface of the reference chuck after grinding or a grinding amount of the reference chuck is set; and a grinding process in which on the basis of the target height or the grinding amount set in the target setting process, surfaces of the plural chucks are ground.SELECTED DRAWING: Figure 7 【課題】基板を加工する加工装置において、基板を保持する複数のチャックを適切に調整する。【解決手段】複数のチャックを備え、当該チャックに保持された基板を加工する加工装置の調整方法であって、前記複数のチャックの表面の高さを計測する高さ計測工程と、前記複数のチャックのうち、基準チャックを選択する基準選択工程と、前記高さ計測工程での計測結果に基づいて、前記基準チャックの表面の研削後の目標高さ又は前記基準チャックの研削量を設定する目標設定工程と、前記目標設定工程で設定された前記目標高さ又は前記研削量に基づいて、前記複数のチャックの表面を研削する研削工程と、を有する。【選択図】図７