METHOD AND DEVICE FOR MEASURING ADHESIVE STRENGTH

• Main Authors: OCHI SHOTA, TAKEDO HIROTAKA, ARAKI KATSUYUKI, YAKIMOTO KAZUTOSHI, ISHIKAWA KANA
• Format: Patent
• Language: English; Japanese
• Published: 12.12.2019
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

To provide a method and a device for measuring an adhesive strength which can highly precisely measure the adhesive strength of a resin to be grasped in its formation process to an attachment test board.SOLUTION: The adhesive strength measuring device includes: an attachment test board fixed to a base board with a heating function and a cooling function; a frame body held on the surface of the attachment test board; application means for applying a thermoplastic resin on the inside and the end upper bottom of the frame body; separation means for separating the coating film formed by the application from the attachment test board in the upper direction with the frame body; and measurement means for measuring the peeling force for the separation.SELECTED DRAWING: Figure 1 【課題】樹脂の成形加工においてその把握が必要とされる樹脂の被着用試験板に対する粘着力を高精度に測定することができる粘着力測定方法及び粘着力測定装置を提供することを目的とする。【解決手段】本発明に係る粘着力測定装置は、加熱及び冷却機能を有する基台に固定される被着用試験板と、その被着用試験板の板面上に保持される枠体と、その枠体の枠内及び縁上底にわたって熱可塑性樹脂を塗布する塗布手段と、その塗布により形成される塗膜を前記枠体とともに前記被着用試験板から上方に引き剥がす剥離手段と、その剥離の際の引剥し力を計測する計測手段と、を有してなる。【選択図】図１