DAMPER GEAR

To improve a fixed state of a heater arranged at a circumferential part of an opening part of a frame.SOLUTION: A damper device 1 comprises a frame 2 having an opening part O, a baffle 3 opening and closing the opening part O, a drive part 10 for the baffle 3, and a heater 7 arranged at a circumfere...

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Bibliographic Details
Main Authors SAITO SHUNJI, HARADA TAKASHI
Format Patent
LanguageEnglish
Japanese
Published 12.12.2019
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Summary:To improve a fixed state of a heater arranged at a circumferential part of an opening part of a frame.SOLUTION: A damper device 1 comprises a frame 2 having an opening part O, a baffle 3 opening and closing the opening part O, a drive part 10 for the baffle 3, and a heater 7 arranged at a circumferential part 2f of the opening part O of the frame 2, in which the heater 7 is sheet-like, and has a plurality of terminals 9 for supplying electricity to the heater 7, and also has a plurality of hole parts 22 formed, an inter-terminal hole part 22a located between terminals 9 and a non-inter-terminal hole 22b located not between the terminals 9 being formed as the hole parts 22, the circumferential part 2f has a plurality of projection parts 8 formed to engage the hole parts 22, an inter-terminal projection part 8a engaging an inter-terminal hole part 22a and a non-inter-terminal projection part 8b engaging the non-inter-terminal hole part 22b being formed as the projection parts 8, and the inter-terminal projection part 8a projecting from an arrangement surface 2d for the heater 7 at the circumferential part 2f more than the non-inter-terminal projection part 8b.SELECTED DRAWING: Figure 7 【課題】フレームにおける開口部の周囲部に配置されるヒータの固定状態を向上する。【解決手段】開口部Oを有するフレーム2と、開口部Oを開閉するバッフル3と、バッフル3の駆動部10と、フレーム2における開口部Oの周囲部2fに配置されるヒータ7と、を備え、ヒータ7は、シート状であり、ヒータ7に電気を供給する複数の端子9を有し、複数の孔部22が形成されており、孔部22として、端子9の間に位置する端子間孔部22aと端子9の間以外に位置する非端子間孔部22bとが形成され、周囲部2fは、孔部22と嵌合する複数の凸部8が形成され、凸部8として、端子間孔部22aと嵌合する端子間凸部8aと非端子間孔部22bと嵌合する非端子間凸部8bとが形成され、端子間凸部8aは、周囲部2fにおけるヒータ7の配置面2dに対して、非端子間凸部8bよりも突出しているダンパ装置1。【選択図】図7
Bibliography:Application Number: JP20180110320