CRIMP METHOD AND CRIMP DEVICE

• Main Authors: YAMADA SHINGO, TSUJISAWA TAKAFUMI, MATSUO NOBUYA
• Format: Patent
• Language: English; Japanese
• Published: 05.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a crimp method capable of easily equalizing production conditions for a plurality of boards.SOLUTION: This crimp method includes: a first supporting step (S11) of making a first receiving part 53A support an undersurface of a first board 7A; a suction step (S12) of making a first sucking part 53C suck a first board 7A so that the first board 7A is kept in a state of being supported by the first receiving part 53A; a second supporting step (S13) of making a second receiving part 53B support an undersurface of a second board 7B held by a second holding part 54B when the first board 7A is made to be supported by the first receiving part 53A by suction of the first sucking part 53C; and a crimp step (S14) of crimping a crimp target on the first board 7A sucked by the first sucking part 53C and supported by the first receiving part 53A and crimping a crimp target on the second board 7B supported by the second receiving part 53B.SELECTED DRAWING: Figure 11 【課題】複数の基板の生産条件を容易に等しくすることができる圧着方法を提供する。【解決手段】この圧着方法は、第１の基板７Ａの下面を第１の下受部５３Ａに支持させる第１の支持工程（Ｓ１１）と、第１の基板７Ａが第１の下受部５３Ａに支持された状態に維持されるように、第１の吸引部５３Ｃに第１の基板７Ａを吸着させる吸着工程（Ｓ１２）と、第１の吸引部５３Ｃによる吸着によって、第１の基板７Ａが第１の下受部５３Ａに支持されているときに、第２の保持部５４Ｂに保持されている第２の基板７Ｂの下面を第２の下受部５３Ｂに支持させる第２の支持工程（Ｓ１３）と、第１の吸引部５３Ｃによって吸着され、かつ、第１の下受部５３Ａに支持されている第１の基板７Ａに圧着対象物を圧着し、第２の下受部５３Ｂに支持されている第２の基板７Ｂに圧着対象物を圧着する圧着工程（Ｓ１４）とを含む。【選択図】図１１