LIGHT-EMITTING ELEMENT, LIGHT-EMITTING ELEMENT PACKAGE AND METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT

To provide: a light-emitting element which can simplify a manufacturing process and which can endure the manufacturing process; a light-emitting element package including the light-emitting element; and a method for manufacturing the light-emitting element.SOLUTION: A light-emitting element comprise...

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Bibliographic Details
Main Authors MATSUI NOBUAKI, FUJIMORI TAKAO
Format Patent
LanguageEnglish
Japanese
Published 28.11.2019
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Summary:To provide: a light-emitting element which can simplify a manufacturing process and which can endure the manufacturing process; a light-emitting element package including the light-emitting element; and a method for manufacturing the light-emitting element.SOLUTION: A light-emitting element comprises: a first semiconductor layer; a first ITO layer formed in a first region of a surface of the first semiconductor layer; a first metal layer formed on the first ITO layer; a luminescent layer formed in a second region other than the first region in the surface of the first semiconductor layer; a second semiconductor layer formed on the luminescent layer; a second ITO layer formed on the second semiconductor layer; and a second metal layer formed on the second ITO layer. The first metal layer includes: a first Cr layer laminated on the first ITO layer; and a first Au layer laminated on the first Cr layer. The second metal layer includes: a second Cr layer laminated on the second ITO layer; and a second Au layer laminated on the second Cr layer. The first and second ITO layers contain Cr.SELECTED DRAWING: Figure 2 【課題】製造工程を簡略化でき、製造工程に耐え得る発光素子、これを含む発光素子パッケージおよび発光素子の製造方法を提供する。【解決手段】発光素子は、第1半導体層と、前記第1半導体層の表面の第1領域に形成された第1ITO層と、前記第1ITO層上に形成された第1メタル層と、前記第1半導体層の表面における前記第1領域以外の第2領域に形成された発光層と、前記発光層上に形成された第2半導体層と、前記第2半導体層上に形成された第2ITO層と、前記第2ITO層上に形成された第2メタル層とを含む。前記第1メタル層は、前記第1ITO層上に積層された第1Cr層と、前記第1Cr層上に積層された第1Au層とを含む。前記第2メタル層は、前記第2ITO層上に積層された第2Cr層と、前記第2Cr層上に積層された第2Au層とを含む。前記第1ITO層および第2ITO層は、Crを含む。【選択図】図2
Bibliography:Application Number: JP20190143257