PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

To obtain a photosensitive resin composition achieving both sensitivity and a film residual rate by using a resin prepared by protecting a phenolic hydroxyl group of a novolac resin by an acid decomposable protective group.SOLUTION: The photosensitive resin composition comprises an acid decomposable...

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Bibliographic Details
Main Authors SHIODA HIDEKAZU, IGAWA AKIHIKO
Format Patent
LanguageEnglish
Japanese
Published 28.11.2019
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Summary:To obtain a photosensitive resin composition achieving both sensitivity and a film residual rate by using a resin prepared by protecting a phenolic hydroxyl group of a novolac resin by an acid decomposable protective group.SOLUTION: The photosensitive resin composition comprises an acid decomposable resin, a photoacid generator and a solvent. The acid decomposable resin comprises a novolac resin in which at least a part of phenolic hydroxyl groups is protected by an acid decomposable group, and the novolac resin contains a structural unit derived from o-cresol and a structural unit derived from aldehyde. The acid decomposable group is at least one selected from a set consisting of a 1-ethoxyethyl group and a 1-propoxyethyl group, and the acid decomposable resin has a weight average molecular weight of 3000 to 7000.SELECTED DRAWING: None 【課題】ノボラック樹脂のフェノール性水酸基を酸分解性保護基で保護した樹脂を用いて、感度と残膜率が両立された感光性樹脂組成物を得ること。【解決手段】酸分解性樹脂、光酸発生剤および溶剤を含む感光性樹脂組成物であって、酸分解性樹脂は、ノボラック樹脂のフェノール性ヒドロキシ基の少なくとも一部が酸分解性基で保護されたものであり、ノボラック樹脂は、o−クレゾールに由来する構造単位と、アルデヒドに由来する構造単位とを含み、酸分解性基は、1−エトキシエチル基および1−プロポキシエチル基からなる群より選ばれる少なくともいずれかであり、酸分解性樹脂の重量平均分子量は3000〜7000である感光性樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20180100137