INTERLAYER TRANSMISSION LINE

To provide an interlayer transmission line capable of transmitting broadband high frequency signals with low loss.SOLUTION: An interlayer transmission line comprises a multilayer board 2, high frequency signal lines 3, 4, and an interlayer transmission unit. The high frequency signal lines include c...

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Main Authors SAKURAI KAZUMASA, TAINAKA YUSUKE, KATAYAMA TETSUYA, AOKI KAZUHIRO, SUMIYA YUJI
Format Patent
LanguageEnglish
Japanese
Published 21.11.2019
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
WAVEGUIDES
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Summary:To provide an interlayer transmission line capable of transmitting broadband high frequency signals with low loss.SOLUTION: An interlayer transmission line comprises a multilayer board 2, high frequency signal lines 3, 4, and an interlayer transmission unit. The high frequency signal lines include connection units 31, 41 and line units 32, 42 extending from the connection units and are formed at two outer layers P1, P6 of the multilayer board, respectively. The interlayer transmission unit connects the connection units 31, 41 and includes a conductor tube 30 and impedance matching units 20, 40. The wave guide 30 extends in a lamination direction of the multilayer board 2. The impedance matching units 20, 40 interpose the wave guide 30 therebetween in the lamination direction. The respective impedance matching units 20, 40 include a plurality of ground vias 7, 9 that connect the outer layers P1, P6 with conductor pattern layers P3, P4 of an inner layer, the ground vias 7, 9 being arranged so as to confine an electric field propagating through the impedance matching units 20, 40 while taking the connection units 31, 41 as its center.SELECTED DRAWING: Figure 3 【課題】広帯域の高周波信号を低損失で伝送可能な層間伝送線路を提供する。【解決手段】層間伝送線路であって、多層基板２と、高周波信号線路３，４と、層間伝送部と、を備える。高周波信号線路は、接続部３１，４１と接続部から延伸した線部３２，４２とを有し、多層基板の２つの外層Ｐ１，Ｐ６のそれぞれに形成される。層間伝送部は、接続部３１，４１の間を接続し、導体管３０と、インピーダンス整合部２０，４０と、を有する。導波管３０は、多層基板２の積層方向に延伸する。インピーダンス整合部２０，４０は、積層方向において導波管３０を挟む。インピーダンス整合部２０，４０のそれぞれは、外層Ｐ１，Ｐ６と内層の導体パターン層Ｐ３，Ｐ４とを接続するグランドビア７，９であって、接続部３１，４１を中心にして、インピーダンス整合部２０，４０を伝搬する電界を閉じ込めるように配置された複数のグランドビア７，９を有する。【選択図】図３
Bibliography:Application Number: JP20180216435