CIRCUIT DEVICE

• Main Author: TAKIZAWA MINORU
• Format: Patent
• Language: English; Japanese
• Published: 21.11.2019
• Subjects: ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a circuit device that is small-sized and is easy to handle.SOLUTION: A semiconductor device of an embodiment includes: a wiring board including wiring; an electronic component provided on the wiring board; a second electronic component that is provided on the wiring board and has a height larger than that of the first electronic component; an encapsulation member provided on the wiring board so as to coat the first electronic component and the second electronic component, where a first distance between a first surface of the encapsulation member over the first electronic component and the wiring board is shorter than a second distance between a second surface of the encapsulation member over the second electronic component and the wiring board; and a conductive member provided on the encapsulation member so as to expose the second surface, where a third distance between a third surface of the conductive member provided over the first electronic component and the wiring board is equal to the second distance, and where a film thickness of the conductive member at the third surface is larger than a film thickness of the conductive member at a fourth surface provided between the third surface and the second surface.SELECTED DRAWING: Figure 2 【課題】小型で取り扱いが容易な回路装置を提供する。【解決手段】実施形態の半導体装置は、配線を有する配線基板と、配線基板の上に設けられた第１の電子部品と、配線基板の上に設けられ、第１の電子部品より高さの高い第２の電子部品と、配線基板の上に、第１の電子部品及び第２の電子部品を覆うように設けられた封止部材であって、第１の電子部品の上の封止部材の第１の表面と配線基板の第１の距離よりも、第２の電子部品の上の封止部材の第２の表面と配線基板の第２の距離が長い、封止部材と、第２の表面が露出するように、封止部材の上に設けられた導電部材であって、第１の電子部品の上に設けられた導電部材の第３の表面と配線基板の第３の距離は第２の距離と等しく、第３の表面における導電部材の膜厚は、第３の表面と第２の表面の間に設けられた第４の表面における導電部材の膜厚より厚い。【選択図】図２