SEMICONDUCTOR DEVICE

• Main Author: KAWASHIMA TAKAYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 21.11.2019
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

To reduce inductance in a semiconductor device having a plurality of semiconductor modules.SOLUTION: A semiconductor device comprises a first semiconductor module and a second semiconductor module. The first semiconductor module comprises: a first semiconductor element; a first sealing body for sealing the first semiconductor element; and a first power terminal and a second power terminal connected to the first semiconductor element in the first sealing body and extending out of the first sealing body. The second semiconductor module comprises: a second semiconductor element; a second sealing body for sealing the second semiconductor element; and a third power terminal and a fourth power terminal connected to the second semiconductor element in the second sealing body and extending out of the second sealing body. Outside the first sealing body and the second sealing body, the first power terminal and the fourth power terminal extend opposite to each other and the second power terminal and the third power terminal extend opposite to each other.SELECTED DRAWING: Figure 1 【課題】 複数の半導体モジュールを備える半導体装置においてインダクタンスを低減する。【解決手段】 半導体装置は、第１半導体モジュールと第２半導体モジュールとを備える。第１半導体素子は、第１半導体素子と、第１半導体素子を封止する第１封止体と、第１封止体の内部において第１半導体素子に接続されているとともに第１封止体の外部へ延びる第１電力端子及び第２電力端子とを有する。第２半導体モジュールは、第２半導体素子と、第２半導体素子を封止する第２封止体と、第２封止体の内部において第２半導体素子に接続されているとともに第２封止体の外部へ延びる第３電力端子及び第４電力端子とを有する。第１封止体及び第２封止体の外部では、第１電力端子と第４電力端子とが互いに対向しながら延びており、第２電力端子と第３電力端子とが互いに対向しながら延びている。【選択図】図１