PRINTED CIRCUIT BOARD AND RESIN COMPOSITION FOR IC PACKAGE, AND PRODUCT USING THE SAME

• Main Authors: LEE HWA-YOUNG, SHIM JI HYE, JUNG HYUNG-MI, KIM KI-SEOK
• Format: Patent
• Language: English; Japanese
• Published: 14.11.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a printed circuit board and a resin composition for IC package, and a product using the same.SOLUTION: A resin composition contains, with respect to 100 pts.wt. of a composite epoxy-based resin: (a) a composite epoxy-based resin containing 5-20 pts.wt. of a bisphenol A type epoxy resin, 30-60 pts.wt. of a cresol novolac type epoxy resin, 20-35 pts.wt. of a phosphorus-based flame-retardant epoxy resin and 5-30 pts.wt. of a rubber-modified type epoxy resin; (b) an aminotriazine-based curing agent; (c) a curing accelerator; (d) an inorganic filler; and (e) 0.01-5 pts.wt. of a surface improver with respect to 100 pts.wt. of the composite epoxy-based resin.SELECTED DRAWING: Figure 1 【課題】本発明は、プリント回路基板及びＩＣパッケージ用樹脂組成物、並びにこれを用いた製品を提供する。【解決手段】樹脂組成物は、複合エポキシ系樹脂１００重量部に対して、（ａ）ビスフェノールＡ型エポキシ樹脂５〜２０重量部、クレゾールノボラック型エポキシ樹脂３０〜６０重量部、リン系難燃エポキシ樹脂２０〜３５重量部及びゴム変性型エポキシ樹脂５〜３０重量部を含む複合エポキシ系樹脂と、（ｂ）アミノトリアジン系硬化剤と、（ｃ）硬化促進剤と、（ｄ）無機充填剤と、（ｅ）複合エポキシ系樹脂１００重量部に対して表面改善剤０．０１〜５重量部とを含む。【選択図】図１