PRINTED CIRCUIT BOARD AND RESIN COMPOSITION FOR IC PACKAGE, AND PRODUCT USING THE SAME

• Main Authors: LEE HWA-YOUNG, SHIM JI HYE, JUNG HYUNG-MI, KIM KI-SEOK
• Format: Patent
• Language: English; Japanese
• Published: 14.11.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a printed circuit board and/or a resin composition for IC package which improves reliability, thermal stability and mechanical strength, and improves an adhesive force with a wiring layer.SOLUTION: A resin composition contains: (a) a composite epoxy-based resin containing 5-10 pts.wt. of a bisphenol A type epoxy resin, 5-10 pts.wt. of a naphthalene type epoxy resin, 10-40 pts.wt. of a cresol novolac type epoxy resin, more than 10 and 30 or less pts.wt. of a rubber-modified type epoxy resin and 30 or more and less than 50 pts.wt. of a biphenylaralkyl novolac type epoxy resin; (b) a composite curing agent containing a DCPD-based (dicyclopentadiene type) curing agent, a biphenylaralkyl novolac-based curing agent and a zyloc-based curing agent; (c) a curing accelerator; (d) an inorganic filler; and (e) a thickner.SELECTED DRAWING: Figure 1 【課題】信頼性、熱的安定性及び機械的強度が向上され、配線層との密着力が改善されたプリント回路基板及び／またはＩＣパッケージ用樹脂組成物の提供。【解決手段】（ａ）ビスフェノールＡ型エポキシ樹脂５〜１０重量部、ナフタレン型エポキシ樹脂５〜１０重量部、クレゾールノボラック型エポキシ樹脂１０〜４０重量部、ゴム変性型エポキシ樹脂１０超過３０以下重量部、及びビフェニルアラルキルノボラック型エポキシ樹脂３０以上５０未満重量部を含む、複合エポキシ系樹脂；（ｂ）ＤＣＰＤ系（ｄｉｃｙｃｌｏｐｅｎｔａｄｉｅｎｅ ｔｙｐｅ）硬化剤、ビフェニルアラルキルノボラック系硬化剤、及びザイロック系硬化剤を含む複合硬化剤；（ｃ）硬化促進剤；（ｄ）無機充填剤；並びに（ｅ）増粘剤を含む、樹脂組成物。【選択図】図１