IMIDAZOLYL SUCCINIMIDE COMPOUND AND ITS USE

• Main Authors: FUJIKAWA KAZUYUKI, TAKEDA TAKUMA, KUMANO TAKESHI, OKUMURA NAOTO
• Format: Patent
• Language: English; Japanese
• Published: 14.11.2019
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; HETEROCYCLIC COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide a curing agent of a new epoxy resin; an epoxy resin composition using the imidazolyl succinimide compound; and an adhesive, a sealant, a sealing material, a paste agent and a film using the epoxy resin composition.SOLUTION: An imidazolyl succinimide compound is represented by Chemical Formula (Ia). Specific example thereof includes the following compound.SELECTED DRAWING: None 【課題】新規エポキシ樹脂の硬化剤、および、当該イミダゾリルスクシンイミド化合物を使用したエポキシ樹脂組成物、更に、このエポキシ樹脂組成物を使用した接着剤、シール剤、封止材、ペースト剤およびフィルムの提供。【解決手段】化学式（Ia）で示されるイミダゾリルスクシンイミド化合物。具体例として、下記化合物が上げられる。【選択図】なし