RESIN COMPOSITION, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: KAKIYA MINORU, MORITA KOJI, SHIMADA MAMI, TANIGAWA TAKAO
• Format: Patent
• Language: English; Japanese
• Published: 07.11.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition which is excellent in high-frequency characteristics (low dielectric constant and low dielectric loss tangent) and can obtain uniform plate thickness even when being pressure-bonded to a circuit board by heat press molding; and a resin film, a metal-clad laminate, a printed wiring board and a semiconductor package using the resin composition.SOLUTION: There are provided a resin composition which contains (A) a compound having a maleimide group, a divalent group having at least two imide bonds and two saturated or unsaturated divalent hydrocarbon groups, (B) an organic peroxide, and (C) one or more curing accelerators selected form the group consisting of an organic peroxide different from the component (B), an organic metal catalyst and an amine compound; and a resin film, a metal-clad laminate, a printed wiring board and a semiconductor package using the resin composition.SELECTED DRAWING: Figure 1 【課題】高周波特性（低誘電率、低誘電正接）に優れ、加熱プレス成形によって回路基板に圧着させる場合においても均一な板厚が得られる樹脂組成物、該樹脂組成物を用いた樹脂フィルム、金属張積層板、プリント配線板及び半導体パッケージを提供する。【解決手段】（Ａ）マレイミド基、少なくとも２つのイミド結合を有する２価の基、及び飽和又は不飽和の２価の炭化水素基を有する化合物と、（Ｂ）有機過酸化物と、（Ｃ）（Ｂ）成分とは異なる有機過酸化物、有機金属触媒及びアミン化合物からなる群から選択される１種以上の硬化促進剤と、を含有する樹脂組成物、該樹脂組成物を用いた樹脂フィルム、金属張積層板、プリント配線板及び半導体パッケージである。【選択図】図１