INDUCTOR COMPONENT, PACKAGE COMPONENT, AND SWITCHING REGULATOR

• Main Authors: YOSHIOKA YOSHIMASA, KUDO NORIZANE, YASUDA SHINJI, HAMADA AKINORI
• Format: Patent
• Language: English; Japanese
• Published: 31.10.2019
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRICITY; GENERATION; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

To provide an inductor component capable of handling high frequencies while keeping strength, and capable of achieving for low profile and down-sizing.SOLUTION: An inductor component 1 has: a composite body 30 constituted of composite layers 31 to 34 of multiple layers composed of an inorganic filler and resin composite material; and spiral wirings 21 and 22 of multiple layers laminated, respectively, on the composite layers, and covered with a composite layer of an upper layer than the composite layers. Average grain size of the inorganic filler is 5 μm or less, a wiring pitch of the spiral wirings 21 and 22 is 10 μm or less, and an interlayer pitch of the spiral wirings 21 and 22 is 10 μm or less.SELECTED DRAWING: Figure 1A 【課題】強度を保持しつつ、高周波に対応可能となり、低背小型化を図ることができるインダクタ部品を提供する。【解決手段】インダクタ部品１は、無機フィラーおよび樹脂のコンポジット材料からなる複数層のコンポジット層３１〜３４から構成されるコンポジット体３０と、それぞれがコンポジット層上に積層されると共に、当該コンポジット層より上層のコンポジット層に覆われた複数層のスパイラル配線２１、２２とを有する。無機フィラーの平均粒径は、５μｍ以下であり、スパイラル配線２１、２２の配線ピッチは、１０μｍ以下であり、スパイラル配線２１、２２の層間ピッチは、１０μｍ以下である。【選択図】図１Ａ