COMPONENT MOUNTING LINE, COMPONENT MOUNTING METHOD, AND QUALITY CONTROL SYSTEM

• Main Authors: IKEDA MASANORI, FUKASAWA KATSUSUKE, ITOSE KAZUHIKO
• Format: Patent
• Language: English; Japanese
• Published: 31.10.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a component mounting line, a component mounting method, and a quality control system, capable of suppressing production of defective products by predicting a timing of solder joint failure between a substrate and components.SOLUTION: A component mounting line 1 includes a plurality of component mounting apparatuses for mounting a solder and components other than the solder on a substrate. The component mounting line 1 includes: a time limit management unit 82 for managing an elapsed period of a member after the member including at least one of the substrate, the solder, and components other than the solder is exposed to the atmosphere; and a use determination unit 84 for determining whether the member can be used on the basis of an elapsed time of the member.SELECTED DRAWING: Figure 6 【課題】部品実装方法及び品質管理システムによれば、基板と部品との半田の接合不良となるタイミングを予兆することで、不良品の製造を抑制することができる部品実装ライン、部品実装方法及び品質管理システムを提供する。【解決手段】部品実装ライン１は、基板に半田及び半田以外の部品を実装する複数の部品実装用装置を備える。部品実装ライン１は、基板、半田及び半田以外の部品の少なくとも１つを含む部材が大気に暴露してからの部材の経過期間を管理する期限管理部８２と、部材の経過期間に基づいて、部材の使用可否を判定する使用判定部８４とを備える。【選択図】図６