SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

• Main Authors: HAYASHI MASAYUKI, TAKEAKI REI, OTA TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 24.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a substrate processing method and a substrate processing apparatus capable of suppressing a change in the processing rate between a plurality of substrates.SOLUTION: A substrate processing method includes a temperature adjustment step S2 and a processing step S3. In the temperature adjust...