CONDUCTIVE FILM

• Main Authors: TOGAWA HITOMI, NEMOTO TOMOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 17.10.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a conductive film that has high conductivity, and has sufficient tensile breaking elongation for use in a processing step after film making, wherein, when stretched, the conductive film maintains high conductivity while showing excellent tensile characteristics in a thin film.SOLUTION: A conductive film has a resin composition containing crystalline olefinic resin (A), thermoplastic elastomer (B) and conductive filler (C), with a crystal heat of fusion (ΔHm) of 50-85 J/g, the conductive film having a tensile breaking elongation of 6% or more and a volume resistance of 15 Ω cm or less.SELECTED DRAWING: None 【課題】高い導電性を有し、かつ製膜後の加工過程で使用するにあたり十分な引張破断伸びを有する導電フィルムであって、延伸加工したときに高い導電性を維持しながら、薄膜で良好な引張特性を示す導電フィルムを提供する。【解決手段】結晶性オレフィン系樹脂（Ａ）と熱可塑性エラストマー（Ｂ）と導電性フィラー（Ｃ）とを含み、結晶融解熱量（ΔＨｍ）が５０〜８５Ｊ／ｇである樹脂組成物からなり、引張破断伸びが６％以上であり、体積抵抗値が１５Ω・ｃｍ以下である、導電フィルム。【選択図】なし