CONDUCTIVE PATH
To provide a conductive path capable of improving heat dissipation of electric wires arranged in the conductive path.SOLUTION: A conductive path 20 includes: an electric wire 10; a metal routing member 31 having a routing groove 35 in which the electric wire 10 is routed; a metal bracket 39 having a...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
10.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a conductive path capable of improving heat dissipation of electric wires arranged in the conductive path.SOLUTION: A conductive path 20 includes: an electric wire 10; a metal routing member 31 having a routing groove 35 in which the electric wire 10 is routed; a metal bracket 39 having a first attachment portion 40 attached to the routing member 31 and a second attachment portion 41 attached to an electricity storage module 21 or an electrical junction box 22; and a heat transfer member 60 made of synthetic resin having a high heat conductivity more than air, that is disposed inside the routing groove 35 and is interposed between the electric wire 10 and the routing member 31, in a region corresponding to a portion of the routing member 31 where the first mounting portion 40 is attached.SELECTED DRAWING: Figure 2
【課題】導電路に配された電線の放熱性を向上させる。【解決手段】導電路20は、電線10と、電線10が配索される配索溝35を有した金属製の配索部材31と、配索部材31に取り付けられる第1取り付け部40を有すると共に、蓄電モジュール21又は電気接続箱22に取り付けられる第2取り付け部41を有する金属製のブラケット39と、配索部材31のうち第1取り付け部40が取り付けられた部分に対応する領域において、配索溝35の内部に配されて電線10と配索部材31との間に介在する、空気よりも熱伝導率の大きな合成樹脂製の伝熱部材60と、を備える。【選択図】図2 |
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Bibliography: | Application Number: JP20180062111 |