TRANSFER SUBSTRATE, MOUNTING METHOD USING THE SAME, AND MANUFACTURING METHOD OF IMAGE DISPLAY DEVICE

• Main Authors: ASAHI NOBORU, HASHIMOTO YASUNORI
• Format: Patent
• Language: English; Japanese
• Published: 10.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a transfer substrate capable of surely transferring only a chip of a transfer object without damaging when a chip component is transferred to a substrate of a transference destination with a laser lift-off method, a mounting method using them, and a manufacturing method of an image display device.SOLUTION: The present invention provide a transfer substrate which is used for transferring each chip component to a transfer destination substrate by irradiating a laser beam while holding the plurality of chip components transferred, comprises: a base substrate having light transmissivity against the laser beam; and an adhesion layer formed on a surface of the base substrate, and having an adhesion performance against each chip component, in which the adhesion layer is formed by a plurality of adhesion islands in a surface of the surface of the base substrate, and each adhesion island has a formation and distribution that contacts with one chip component with the plurality of them. In addition, the present invention provides a mounting method using the transfer substrate, and a manufacturing method of an image display device.SELECTED DRAWING: Figure 1 【課題】 レーザーリフトオフ法でチップ部品を転写先の基板に転写するのに際して、転写対象のチップのみを破損することなく確実に転写することができる転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法を提供すること。【解決手段】 転写された複数のチップ部品を保持し、レーザー光の照射により前記チップ部品を転写先基板に転写するのに用いる転写基板であって、前記レーザー光に対して透光性を有するベース基板と、前記ベース基板表面に形成された、前記チップ部品に対して接着性を有する接着層とを備え、前記接着層は前記ベース基板表面の面内に複数の接着島で形成されており、前記接着島は、前記チップ部品１つに対して複数で接触する形状および分布である転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法を提供する。【選択図】 図１