SOLVENT-LESS METHOD FOR MANUFACTURING THIN FILM DEVICES

To provide: a method of removing a multi-layer structure from a web having a release layer, without the use of caustic solvents, e.g., a method of using a simpler and less expensive dry process instead of current wet processes; and, additionally or alternatively, a method of removing multi-layer str...

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Bibliographic Details
Main Authors LIANG KANGNING, JOHANNES P SEYDEL, ALBERTO ARGOITIA, JAROSLAW ZIEBA
Format Patent
LanguageEnglish
Japanese
Published 10.10.2019
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:To provide: a method of removing a multi-layer structure from a web having a release layer, without the use of caustic solvents, e.g., a method of using a simpler and less expensive dry process instead of current wet processes; and, additionally or alternatively, a method of removing multi-layer structures from a web not having a release layer.SOLUTION: A method of forming a thin film device includes: coating a web 40 with a multi-layer thin film 20; and applying a mechanical force to release the multi-layer thin film 20 from the web 40. Another method includes: forming a multi-layer thin film 20 by coating; and releasing the multi-layer thin film 20 from the web 40 by a dry technique.SELECTED DRAWING: Figure 4 【課題】剥離層を備えたウェブから多層構造体を除去する、苛性溶剤を用いずに除去する方法、例えば、現行のウェットプロセスの代わりに単純で安価なドライプロセスを用いる方法を実現する。さらに、又は代替的に、剥離層を備えないウェブから多層構造体を除去する方法を実現する。【解決手段】薄膜デバイスを形成する方法は、ウェブ４０を多層薄膜２０でコーティングするステップと、機械力を加えてウェブ４０から多層薄膜２０を剥離するステップとを含む。さらに、別の方法として、コーティングによる多層薄膜２０を形成するステップと、ドライ技法によりウェブ４０から多層薄膜２０を剥離するステップとを含む。【選択図】図４
Bibliography:Application Number: JP20190046030