COMPOSITION FOR FORMING PEELING LAYER

To provide a composition for forming a peeling layer, with which adhesion to a glass substrate having the peeling layer formed thereon is maintained and peeling at the interface with the glass substrate does not take place, and on the other hand a layer or a group of layers formed on the upper side...

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Bibliographic Details
Main Authors SHINDO KAZUYA, EBARA KAZUYA
Format Patent
LanguageEnglish
Japanese
Published 10.10.2019
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Summary:To provide a composition for forming a peeling layer, with which adhesion to a glass substrate having the peeling layer formed thereon is maintained and peeling at the interface with the glass substrate does not take place, and on the other hand a layer or a group of layers formed on the upper side of the peeling layer is/are easily peeled off from the peeling layer.SOLUTION: The problem is solved by using a composition which is a composition for forming a peeling layer just above a glass substrate and which has: (A) an aromatic polyimide and/or an aromatic polyimide precursor; and (B) an amide-based solvent and in which the aromatic polyimide derived from (A) satisfies (1) to (4) written below: (1) a temperature of 1% weight loss in weight change on heating is 500°C or more; (2) the refractive index at a wave length of 1,000 nm is 1.7 or more; (3) difference between the refractive index and the birefringence at the wave length of 1,000 nm is 0.15 or more; and (4) the surface energy is 40 dyne/cm or more.SELECTED DRAWING: None 【課題】剥離層が設けられるガラス基板との密着性が維持されガラス基板との界面での剥離が生じない一方、剥離層より上部に形成される層又は層群を剥離層から簡易に剥離することができる、該剥離層を形成するための組成物の提供。【解決手段】ガラス基板直上に設ける剥離層を形成するための組成物であって、該組成物が(A)芳香族ポリイミド及び/又は芳香族ポリイミド前駆体;及び(B)アミド系溶媒;を有し、前記(A)由来の芳香族ポリイミドは、下記(1)〜(4)を満たす組成物により、上記課題を解決する:(1)加熱時の重量変化における1%重量減少の温度が500℃以上;(2)波長1000nmで屈折率が1.7以上;(3)波長1000nmで屈折率と複屈折の差が0.15以上;及び(4)表面エネルギーが40dyne/cm以上。【選択図】なし
Bibliography:Application Number: JP20190108806