SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

• Main Author: KAWASAKI KAZUSHIGE
• Format: Patent
• Language: English; Japanese
• Published: 03.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a semiconductor device that can achieve reduced size and lower cost, and a method of manufacturing the same.SOLUTION: A semiconductor device includes: a base member; a first stacked body including a first semiconductor chip and a second semiconductor chip which are alternately stacked in a first direction intersecting a surface of the base member; and a second stacked body disposed side by side with the first stacked body in a second direction along the surface of the base member, the second stacked body including a first semiconductor chip and a second semiconductor chip which are alternately stacked in the first direction. The first stacked body includes a first semiconductor chip in the lowermost layer connected to the base member, and the second stacked body includes a second semiconductor chip in the lowermost layer connected to the base member.SELECTED DRAWING: Figure 1 【課題】小型化および低コスト化が可能な半導体装置およびその製造方法を提供する。【解決手段】半導体装置は、ベース部材と、前記ベース部材の表面と交差する第１方向に交互に積層された第１半導体チップと第２半導体チップとを含む第１積層体と、前記ベース部材の前記表面に沿った第２方向に、前記第１積層体と並べて配置され、前記第１方向に交互に積層された別の第１半導体チップと別の第２半導体チップとを含む第２積層体と、を備える。前記第１積層体は、前記ベース部材に接続された最下層の第１半導体チップを含み、前記第２積層体は、前記ベース部材に接続された最下層の第２半導体チップを含む。【選択図】図１