SEMICONDUCTOR STORAGE DEVICE
To provide a semiconductor storage device that can be made fine.SOLUTION: A semiconductor storage device according to an embodiment includes: a substrate; a control circuit provided on the substrate and including a transistor; a first pad region including a pad above the substrate; a second pad regi...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
03.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor storage device that can be made fine.SOLUTION: A semiconductor storage device according to an embodiment includes: a substrate; a control circuit provided on the substrate and including a transistor; a first pad region including a pad above the substrate; a second pad region including a pad above the substrate; n wiring layers; and a first wiring region. The n wiring layers are n (n: a natural number equal to or larger than 3) wiring layers above the substrate, and the n wiring layers are positioned at mutually different heights from the substrate, the n wiring layers including wiring, respectively. The first wiring region is positioned between an end of the control circuit and an end of the substrate in a direction in which a first axis extends, and arranged side by side with the first pad region in a direction in which a second axis extends, and includes neither the transistor nor a contact connected to the substrate either, m (m: a natural number which is 3 or larger, and larger than n/2 and less than n) of the n wiring layers including wiring extending along the second axis.SELECTED DRAWING: Figure 3
【課題】微細化可能な半導体記憶装置を提供する。【解決手段】 実施形態の半導体記憶装置は、基板と、基板上に設けられ、トランジスタを含んだ制御回路と、基板の上方のパッドを含んだ第1パッド領域と、基板の上方のパッドを含んだ第2パッド領域と、n個の配線層と、第1配線領域と、を含む。n個の配線層は、基板の上方のn(nは3以上の自然数)個の配線層であって、n個の配線層はn個の配線層は基板から互いに異なる高さに位置し、n個の配線層の各々は配線を含む。第1配線領域は、第1軸の延びる方向において制御回路の端と基板との端との間に位置するとともに第2軸の延びる方向において第1パッド領域と並び、トランジスタを含まず、基板と接続されたコンタクトを含まず、n個の配線層のうちのm(mは3以上且つn/2超且つn以下の自然数)個の配線層において第2軸に沿って延びる配線を含む。【選択図】 図3 |
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Bibliography: | Application Number: JP20180054562 |