COMPOSITION FOR SEMICONDUCTOR PROCESS AND SEMICONDUCTOR PROCESS
To provide a composition for a semiconductor process where the composition is applied to the semiconductor process to provide a wafer that has excellent surface properties, and a semiconductor process conducted using the composition for a semiconductor process.SOLUTION: A composition for a semicondu...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
26.09.2019
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a composition for a semiconductor process where the composition is applied to the semiconductor process to provide a wafer that has excellent surface properties, and a semiconductor process conducted using the composition for a semiconductor process.SOLUTION: A composition for a semiconductor process comprises: a first component comprising an inorganic acid or organic acid; and a second component comprising a compound represented by formula 1 or 2. A semiconductor process comprises selectively cleaning and/or removing an organic substance or inorganic substance using the composition.SELECTED DRAWING: None
【課題】本発明により、組成物を半導体プロセスに適用して優れた表面特性を有するウエハを提供する半導体プロセス用組成物、および上記半導体プロセス用組成物を用いて行われる半導体プロセスを提供する。【解決手段】本発明は、無機酸または有機酸を含む第1の成分;および式1または式2によって表される化合物を含む第2の成分を含む半導体プロセス用組成物、並びに前記組成物を用いて有機物質または無機物質を選択的に洗浄および/または除去する半導体プロセスに関する。【選択図】なし |
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Bibliography: | Application Number: JP20190039152 |