OPTICAL SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF THE SAME

• Main Author: FURUYAMA HIDETO
• Format: Patent
• Language: English; Japanese
• Published: 26.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide an optical semiconductor module capable of reducing costs and a method for manufacturing the same.SOLUTION: Reflectance of light emitted from a semiconductor laser at an interface between a second surface of a first silicon substrate and a film is lower than reflectance of the light emitted from the semiconductor laser is lower than the reflectance at the interface between the second surface of the first silicon substrate and the lens member. Reflectance of the light received by a light receiving element at an interface between the fourth surface of a second silicon substrate and the film is lower than reflectance of light received by the light receiving element at an interface between the fourth surface of the second silicon substrate and a lens member.SELECTED DRAWING: Figure 1 【課題】低コスト化が可能な光半導体モジュール及びその製造方法を提供する。【解決手段】半導体レーザが出射する光の、第１シリコン基板の第２面と膜との界面での反射率は、半導体レーザが出射する光の、第１シリコン基板の第２面とレンズ部材との界面での反射率よりも低い。受光素子が受光する光の、第２シリコン基板の第４面と膜との界面での反射率は、受光素子が受光する光の、第２シリコン基板の第４面とレンズ部材との界面での反射率よりも低い。【選択図】図１