HEAT CONDUCTIVE RESIN COMPOSITION AND MOLDED BODY

• Main Authors: MASUDA KEISUKE, MAJIMA YUKI, TAKAHASHI ATSUSHI, FUKUHARA KOICHIRO
• Format: Patent
• Language: English; Japanese
• Published: 26.09.2019
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition having good heat conductivity and molding processability, and capable of forming a molded body good in mechanical strength, and the molded body.SOLUTION: The heat conductive resin composition contains a polyamide resin (A), an acid modified article of an ethylene-α-olefin copolymer containing a structural unit derived from ethylene and a structural unit derived from α-olefin having 3 to 20 carbon atoms (B) and an inorganic filler (C). Content ratio of the polyamide resin (A) and the acid modified article of the ethylene-α-olefin copolymer (B) is polyamide resin (A)/acid modified article of the ethylene-α-olefin copolymer=70/30 to 95/5, the polyamide resin (A) is 10 to 40 mass%, the acid modified article of the ethylene-α-olefin copolymer (B) is 0.6 to 17 mass%, and the inorganic filler (C) is 40 to 80 mass% in 100 mass% of whole resin composition.SELECTED DRAWING: None 【課題】良好な熱伝導性、成形加工性を有し、機械強度が良好な成形体を形成できる樹脂組成物および成形体を提供する。【解決手段】本発明に係る熱伝導性樹脂組成物は、ポリアミド樹脂（Ａ）、エチレン由来の構造単位および炭素数が３〜２０のα−オレフィン由来の構造単位を含むエチレン−α−オレフィン共重合体の酸変性物（Ｂ）および無機充填剤（Ｃ）を含む。そして、ポリアミド樹脂（Ａ）とエチレン−α−オレフィン共重合体の酸変性物（Ｂ）の含有量比が、ポリアミド樹脂（Ａ）／エチレン−α−オレフィン共重合体の酸変性物（Ｂ）＝７０／３０〜９５／５であり、樹脂組成物の全体１００質量％中、ポリアミド樹脂（Ａ）は１０〜４０質量％、エチレン−α−オレフィン共重合体の酸変性物（Ｂ）は０．６〜１７質量％、無機充填剤（Ｃ）は４０〜８０質量％である。【選択図】なし