HEATING COMPONENT MOUNTING BODY

• Main Authors: SHIMONOSONO MASARU, KAWAKITA YOSHIHIRO, MIYAKE TAKAHIRO, TSUKAHARA NORITO
• Format: Patent
• Language: English; Japanese
• Published: 19.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To provide a heating component mounting body in which a flow of a bonding material during heating is suppressed and mounting accuracy can be improved.SOLUTION: The heating component mounting body includes: a heating component 102 having electrodes 111a, 111b; a substrate 101 having a heat dissipating member 104 and conductors 106, 109 provided facing the electrodes 111a, 111b; bonding materials 103a, 103b for bonding the electrodes 111a, 111b and the conductors 106, 109; and bonding material restricting portions 107a, 110 provided around the bonding materials 103a, 103b.SELECTED DRAWING: Figure 1 【課題】加熱時の接合材の流れを抑止して、実装精度を向上できるようにした発熱部品実装体を提供する。【解決手段】電極１１１ａ、１１１ｂを有する発熱部品１０２と、放熱部材１０４、および、電極１１１ａ、１１１ｂに対向して設けられている導体１０６、１０９を有する基板１０１と、電極１１１ａ、１１１ｂと前記導体１０６、１０９とを接合している接合材１０３ａ、１０３ｂと、接合材１０３ａ、１０３ｂの周囲に設けられた接合材規制部１０７ａ、１１０とを備える。【選択図】図１