EPOXY RESIN COMPOSITION

• Main Authors: IWATANI KAZUKI, SAITO ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 19.09.2019
• Subjects: ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an epoxy resin composition providing a cured article which is cured in short time even under a low temperature condition, is low in glass transition point (T), which has almost no change even after long time passed after curing, an encapsulation material containing the same, a cured article obtained by curing the same, and an electronic component containing the cured article thereof.SOLUTION: There is provided an epoxy resin composition containing (A) a thiol-based curing agent containing a polyfunctional thiol compound having 3 or more thiol groups; (B) a polyfunctional epoxy resin; (C) a crosslinking density regulator containing a monofunctional epoxy resin; and (D) a potential curing catalyst, and having a ratio of total of epoxy functional group equivalent of (B) and (C) based on thiol functional group equivalent of (A) ([epoxy functional group equivalent]/[thiol functional group equivalent]) of 0.8 to 1.2, a ratio of the epoxy functional group equivalent of (B) based on the thiol functional group equivalent of (A) ([epoxy functional group equivalent]/[thiol functional group equivalent]) of 0.4 to 0.7.SELECTED DRAWING: None 【課題】本発明は、低温条件下でも短時間で硬化して、ガラス転移点（Ｔｇ）が低く、硬化後に長時間経過してもＴｇがほとんど変化しない硬化物を与えるエポキシ樹脂組成物、それを含む封止材、それを硬化させて得られる硬化物及びその硬化物を含む電子部品。【解決手段】（Ａ）チオール基を３つ以上有する多官能チオール化合物を含むチオール系硬化剤；（Ｂ）多官能エポキシ樹脂；（Ｃ）単官能エポキシ樹脂を含む架橋密度調節剤；及び（Ｄ）潜在性硬化触媒を含むエポキシ樹脂組成物であり、（Ｂ）及び（Ｃ）のエポキシ官能基当量の合計の、（Ａ）のチオール官能基当量に対する比（〔エポキシ官能基当量〕／〔チオール官能基当量〕）が０．８以上、１．２以下であり、（Ｂ）のエポキシ官能基当量の、（Ａ）のチオール官能基当量に対する比（〔エポキシ官能基当量〕／〔チオール官能基当量〕）が０．４以上、０．７以下である。【選択図】なし