POLISHING DEVICE

• Main Authors: YOSHIDA ATSUSHI, DU FENG JIE, KASHIWAGI MAKOTO, YAMASHITA MICHIYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 19.09.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a polishing device which can prevent a polishing tape from being displaced relative to a pressing member during polishing of an edge part of a substrate.SOLUTION: A polishing device includes: a substrate holding part which holds and rotates a substrate; a pressing member 11 which presses a polishing surface of a polishing tape 7 to an edge part of the substrate; a load transmission member 27 which transmits a load, which presses the polishing surface of the polishing tape 7 to the edge part, to the pressing member 11; and a pressing roller mechanism 50 disposed at the polishing surface side of the polishing tape 7. The pressing roller mechanism 50 includes: at least one pressing roller unit 51 having pressing rollers 52 which contact with the polishing surface of the polishing tape 7; biasing means 54 which applies biasing force, which presses an opposite surface of the polishing surface of the polishing tape 7 to the pressing member 11, to the pressing rollers 52; and a biasing force adjustment mechanism 53 which adjusts the biasing force of the biasing means 54.SELECTED DRAWING: Figure 5 【課題】基板のエッジ部の研磨中に、研磨テープが押圧部材に対してずれてしまうことを防止することができる研磨装置を提供する。【解決手段】研磨装置は、基板を保持して回転させる基板保持部と、研磨テープ７の研磨面を基板のエッジ部に対して押し付ける押圧部材１１と、研磨テープ７の研磨面をエッジ部に対して押し付ける荷重を押圧部材１１に伝達する荷重伝達部材２７と、研磨テープ７の研磨面側に配置される押圧ローラ機構５０と、を備える。押圧ローラ機構５０は、研磨テープ７の研磨面に接触する押圧ローラ５２を有する少なくとも１つの押圧ローラユニット５１と、研磨テープ７の研磨面とは反対側の面を押圧部材１１に押し付ける付勢力を押圧ローラ５２に付与する付勢手段５４と、付勢手段５４の付勢力を調整する付勢力調整機構５３と、を備える。【選択図】図５