PHOTOSENSITIVE RESIN COMPOSITION, PATTERNED CURED FILM PRODUCTION METHOD, CURED FILM, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

To provide a photosensitive resin composition capable of forming a cured product having high adhesion after storage in a high-temperature condition even if the curing temperature is 200°C or less, a production method of a patterned cured product using the same, a cured product, an interlayer insulat...

Full description

Saved in:
Bibliographic Details
Main Authors ASADA AKIRA, ENOMOTO TETSUYA, AZUMA AYAKA, YOSHIZAWA ATSUTARO
Format Patent
LanguageEnglish
Japanese
Published 12.09.2019
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:To provide a photosensitive resin composition capable of forming a cured product having high adhesion after storage in a high-temperature condition even if the curing temperature is 200°C or less, a production method of a patterned cured product using the same, a cured product, an interlayer insulating film, a cover coat layer, a surface protective film, and an electronic component.SOLUTION: The photosensitive resin composition comprises (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a polymerizable monomer, (C) a photoinitiator, and (D) a compound represented by a specific formula.SELECTED DRAWING: None 【課題】硬化温度が２００℃以下であっても、高温条件での保存後に高い接着性を有する硬化物を形成可能な感光性樹脂組成物、それを用いたパターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品を提供する。【解決手段】（Ａ）重合性の不飽和結合を有するポリイミド前駆体と、（Ｂ）重合性モノマーと、（Ｃ）光重合開始剤と、（Ｄ）特定の式で表される化合物と、を含む感光性樹脂組成物。【選択図】なし
Bibliography:Application Number: JP20180038759