COMPOSITE PARTICLES, AND METHODS OF REFINEMENT AND USE THEREOF

• Main Authors: MACHADO REINALDO MARIO, MARC O'NEAL LEONARD, TAMBOLI DNYANESH CHANDRAKANT, KRISHNA P MURELLA, ZHOU HONGJUN, JOHN EDWARD QUINCY HUGHES
• Format: Patent
• Language: English; Japanese
• Published: 12.09.2019
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOUNDS THEREOF; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; INORGANIC CHEMISTRY; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-METALLIC ELEMENTS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

To provide refined agglomerated composite particles, methods of refinement, and methods of using the refined particles in polishing applications that can achieve performance requirements.SOLUTION: Composite particles with lower mean particle size and smaller size distribution are obtained through refining treatments. The refined composite particles, such as ceria coated silica particles, are used in Chemical Mechanical Planarization (CMP) compositions to offer a higher removal rate, very low within-wafer non-uniformity (WWNU) for the removal rate, low dishing and low defects for polishing oxide films.SELECTED DRAWING: Figure 1 【課題】精製された凝集複合粒子、精製方法、及び性能要求を達成することができる研磨用途において精製粒子を使用する方法を提供する。【解決手段】より低い平均粒子サイズ及びより小さいサイズ分布を持つ複合粒子は、精製処理を通じて得られる。精製された複合粒子、例えば、セリアコートシリカ粒子は、化学機械平坦化（ＣＭＰ）組成物中で使用されて、酸化物膜の研磨に対して、より高い除去速度、除去速度についての極めて低いウエハ内非均一性（ＷＷＮＵ）、低いディッシング及び低い欠陥を提供する。【選択図】図１