APPARATUS FOR TREATING ACIDIC TREATMENT LIQUID, METHOD FOR TREATING ACIDIC TREATMENT LIQUID, SURFACE TREATMENT SYSTEM, AND SURFACE TREATMENT METHOD

To provide an apparatus for treating an acidic treatment liquid, and a method for treating an acidic treatment liquid capable of removing a metal cation of copper, aluminum and the like from an acidic treatment liquid without reducing a hexavalent chromium concentration.SOLUTION: An apparatus 10 for...

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Main Authors MIKAWA HIROAKI, TAJIMA HIDEHIKO, MIYAZAKI TAISUKE, SAKANISHI AKIHIRO, EGAWA KAORU, KAWASAKI KOHEI, ISHIGAKI MITSUHIRO, IMASAKA KOJI, NAGAI MASAHIKO, URESHINO AYAKO
Format Patent
LanguageEnglish
Japanese
Published 05.09.2019
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Summary:To provide an apparatus for treating an acidic treatment liquid, and a method for treating an acidic treatment liquid capable of removing a metal cation of copper, aluminum and the like from an acidic treatment liquid without reducing a hexavalent chromium concentration.SOLUTION: An apparatus 10 for treating an acidic treatment liquid includes: a tank 11 having a space inside; a separating membrane 12 for comparting the space inside the tank 11 into a first room S1 and a second room S2, and capable of penetrating a metal ion; a first electrode 13 disposed in the first room S1; a second electrode 14 disposed in the second room S2; a power source 15 for applying a voltage to the first electrode 13 as an anode, and to the second electrode 14 as a cathode; a first liquid-feeding part 16 for feeding an acidic treatment liquid containing a dichromic acid ion and a metal cation into the first room S1; and a second liquid-feeding part 17 for feeding an acid aqueous solution into the second room S2.SELECTED DRAWING: Figure 1 【課題】酸性処理液から6価クロム濃度を低下させずに銅、アルミ等の金属陽イオンを除去できる酸性処理液処理装置及び酸性処理液処理方法を提供する。【解決手段】酸性処理液処理装置10は、内部に空間を有する槽11と、槽11の内部の空間を第一室S1と第二室S2とに区画する、金属陽イオンを透過可能な隔膜12と、第一室S1内に設けられた第一電極13と、第二室S2内に設けられた第二電極14と、第一電極13を陽極、第二電極14を陰極として電圧を印加する電源15と、第一室S1内に、二クロム酸イオン及び金属陽イオンを含む酸性処理液を通液する第一通液部16と、第二室S2内に酸水溶液を通液する第二通液部17とを備える。【選択図】図1
Bibliography:Application Number: JP20180205461