SEMICONDUCTOR LIGHT RECEIVING ELEMENT AND MANUFACTURING METHOD OF THE SAME

To provide a semiconductor light-receiving element composed of a compound semiconductor light-receiving layer having a low dark current and excellent light-receiving characteristics and an Si avalanche multiplication layer.SOLUTION: The semiconductor light-receiving element includes: an Si avalanche...

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Main Author FURUYAMA HIDETO
Format Patent
LanguageEnglish
Japanese
Published 29.08.2019
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Abstract To provide a semiconductor light-receiving element composed of a compound semiconductor light-receiving layer having a low dark current and excellent light-receiving characteristics and an Si avalanche multiplication layer.SOLUTION: The semiconductor light-receiving element includes: an Si avalanche multiplication unit provided on an Si substrate 1; an Si-pn junction surrounding the Si avalanche multiplication unit and having a junction end at a different height from the Si avalanche multiplication unit; a passivation film 8 provided at an end of the Si-pn junction; a compound semiconductor light-receiving layer 6 provided selectively in an Si-pn junction region on the Si avalanche multiplication unit.SELECTED DRAWING: Figure 1 【課題】暗電流が低く受光特性に優れた化合物半導体受光層とSiアバランシェ増倍層からなる半導体受光素子の提供。【解決手段】Si基板1に設けられたSiアバランシェ増倍部と、Siアバランシェ増倍部を取り囲み且つSiアバランシェ増倍部と異なる高さに接合端部を有するSi−pn接合と、Si−pn接合端部に設けられたパッシベーション膜8と、Siアバランシェ増倍部上のSi−pn接合領域内に選択的に設けられた化合物半導体受光層6を備える。【選択図】図1
AbstractList To provide a semiconductor light-receiving element composed of a compound semiconductor light-receiving layer having a low dark current and excellent light-receiving characteristics and an Si avalanche multiplication layer.SOLUTION: The semiconductor light-receiving element includes: an Si avalanche multiplication unit provided on an Si substrate 1; an Si-pn junction surrounding the Si avalanche multiplication unit and having a junction end at a different height from the Si avalanche multiplication unit; a passivation film 8 provided at an end of the Si-pn junction; a compound semiconductor light-receiving layer 6 provided selectively in an Si-pn junction region on the Si avalanche multiplication unit.SELECTED DRAWING: Figure 1 【課題】暗電流が低く受光特性に優れた化合物半導体受光層とSiアバランシェ増倍層からなる半導体受光素子の提供。【解決手段】Si基板1に設けられたSiアバランシェ増倍部と、Siアバランシェ増倍部を取り囲み且つSiアバランシェ増倍部と異なる高さに接合端部を有するSi−pn接合と、Si−pn接合端部に設けられたパッシベーション膜8と、Siアバランシェ増倍部上のSi−pn接合領域内に選択的に設けられた化合物半導体受光層6を備える。【選択図】図1
Author FURUYAMA HIDETO
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Snippet To provide a semiconductor light-receiving element composed of a compound semiconductor light-receiving layer having a low dark current and excellent...
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SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SEMICONDUCTOR LIGHT RECEIVING ELEMENT AND MANUFACTURING METHOD OF THE SAME
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