POLYIMIDE PRECURSOR SOLUTION, MOLDED ARTICLE, AND METHOD FOR PRODUCING MOLDED ARTICLE

• Main Authors: NUKADA KATSUMI, HIROSE EIICHI, SASAKI TOMOYA
• Format: Patent
• Language: English; Japanese
• Published: 01.08.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a polyimide precursor solution capable of obtaining a molded article having at least one layer of a porous polyimide film in which an increase in a relative dielectric constant is suppressed and heat conductivity is improved.SOLUTION: A polyimide precursor solution includes: an aqueous solution that contains water; a resin particle that does not dissolve in the aqueous solution; an inorganic particle; and a polyimide precursor.SELECTED DRAWING: None 【課題】比誘電率の上昇を抑制し、熱伝導性が向上している多孔質ポリイミドフィルムを少なくとも１層有する成形体が得られるポリイミド前駆体溶液の提供。【解決手段】水を含む水性溶剤、前記水性溶剤に溶解しない樹脂粒子、無機粒子、及びポリイミド前駆体を含有するポリイミド前駆体溶液。【選択図】なし