GROUND MEMBER, SHIELD PRINTED WIRING BOARD, AND MANUFACTURING METHOD OF SHIELD PRINTED WIRING BOARD

To provide a ground member that can be disposed at an arbitrary position, and is less likely to be displaced between a conductive filler of the ground member and a shield layer of a shield film on a shield printed wiring board using the ground member when a component is mounted by repeating heating...

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Bibliographic Details
Main Authors TAJIMA HIROSHI, HARUNA YUSUKE, HASEGAWA TAKESHI, KATSUKI TAKAHIKO
Format Patent
LanguageEnglish
Japanese
Published 25.07.2019
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Summary:To provide a ground member that can be disposed at an arbitrary position, and is less likely to be displaced between a conductive filler of the ground member and a shield layer of a shield film on a shield printed wiring board using the ground member when a component is mounted by repeating heating and cooling.SOLUTION: A ground member according to the present invention includes a first main surface and a second main surface opposite to the first main surface, and includes an external connection member having conductivity, a conductive filler disposed on the first main surface side, and an adhesive resin for fixing the conductive filler to the first main surface, and the conductive filler includes a low melting point metal.SELECTED DRAWING: Figure 1 【課題】 本発明は、任意の位置に配置できるグランド部材であって、該グランド部材を用いたシールドプリント配線板に、加熱及び冷却を繰り返して部品を実装する際に、グランド部材の導電性フィラーとシールドフィルムのシールド層との間にずれが生じにくいグランド部材を提供することを目的とする。【解決手段】 本発明のグランド部材は、第1主面と、上記第1主面の反対側の第2主面とを有し、かつ、導電性を有する外部接続部材と、上記第1主面側に配置された導電性フィラーと、上記導電性フィラーを上記第1主面に固定する接着性樹脂とからなるグランド部材であって、上記導電性フィラーは、低融点金属を含むことを特徴とする。【選択図】 図1
Bibliography:Application Number: JP20190089152