RESIN COMPOSITION FOR INTERLAYER INSULATION LAYER, RESIN FILM FOR INTERLAYER INSULATION LAYER, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

• Main Authors: SUZUKAWA TAKAYUKI, MATSUURA MASAHARU, TABATA SHIORI
• Format: Patent
• Language: English; Japanese
• Published: 25.07.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin composition for an interlayer insulation layer achieving both low thermal expansion property and adhesiveness to a conductor layer, a resin film for an interlayer insulation layer using the resin composition for an interlayer insulation layer, a multilayer printed wiring board, a semiconductor package and a method for manufacturing a multilayer printed wiring board.SOLUTION: The resin composition for an interlayer insulation layer comprises (A) a thermosetting resin and (B) an inorganic filler. The content of the (B) inorganic filler in the resin composition for an interlayer insulation layer is 55 to 90 vol.%. The (B) inorganic filler comprises (B1) a nano-filler and (B2) a spherical filler having an average particle diameter larger than that of the (B1) nano-filler. The content of the (B1) nano-filler in the resin composition for an interlayer insulation layer is 0.3 to 2 vol.%. The present invention also provides a resin film for an interlayer insulation layer using the above resin composition for an interlayer insulation layer, a multilayer printed wiring board, a semiconductor package and a method for manufacturing a multilayer printed wiring board.SELECTED DRAWING: Figure 1 【課題】低熱膨張性と導体層との密着性を両立させた層間絶縁層用樹脂組成物、該層間絶縁層用樹脂組成物を用いた層間絶縁層用樹脂フィルム、多層プリント配線板、半導体パッケージ及び多層プリント配線板の製造方法を提供する。【解決手段】（Ａ）熱硬化性樹脂と、（Ｂ）無機充填材と、を含有する層間絶縁層用樹脂組成物であり、該層間絶縁層用樹脂組成物中における（Ｂ）無機充填材の含有量が、５５〜９０体積％であり、（Ｂ）無機充填材が、（Ｂ１）ナノフィラーと、該（Ｂ１）ナノフィラーよりも大きい平均粒径を有する（Ｂ２）球状フィラーと、を含有し、前記層間絶縁層用樹脂組成物中における（Ｂ１）ナノフィラーの含有量が、０．３〜２体積％である、層間絶縁層用樹脂組成物、該層間絶縁層用樹脂組成物を用いた層間絶縁層用樹脂フィルム、多層プリント配線板、半導体パッケージ及び多層プリント配線板の製造方法である。【選択図】図１