LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

• Main Authors: YAMAGUCHI YOSHIHIRO, TANIGAWA SADAO, SAWAI YOSHIKI, SAZUKA SUKETAKA, KOBAYASHI NAOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 22.07.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a laser processing apparatus, a laser processing method, and a manufacturing method of a semiconductor device capable of suppressing an increase in area of a stage even when the size of an object to be processed increases.SOLUTION: A laser processing apparatus 1 according to one embodiment includes a processing chamber 18 that performs laser processing of an object 40 to be processed, a stage 10 that is disposed in the processing chamber 18 and transports the object 40 to be processed, and a control unit 50 that instructs an arrangement position of the object to be processed 40 on the stage 10 for a loading/unloading device 30 for loading and unloading the object to be processed 40 into/out of the processing chamber 18. Further, the processing chamber 18 includes a carry-in port 17a for carrying in and a carry-out port 17b for carrying out the object to be processed 40. The object to be processed 40 is conveyed only in a first direction from the carry-in port 17a to the carry-out port 17b on the stage 10.SELECTED DRAWING: Figure 1 【課題】被処理体のサイズが増大してもステージの面積の増大を抑制することができるレーザ処理装置、レーザ処理方法及び半導体装置の製造方法を提供する。【解決手段】一実施の形態に係るレーザ処理装置１は、被処理体４０のレーザ処理を行うための処理室１８と、処理室１８内に配置された、被処理体４０を搬送するためのステージ１０と、被処理体４０を処理室１８内に搬入および搬出する搬入出装置３０に対し、被処理体４０のステージ１０上での配置位置を指示する制御部５０と、を有する。また、処理室１８は、被処理体４０の搬入用の搬入口１７ａおよび搬出用の搬出口１７ｂを有し、被処理体４０は、ステージ１０上の、搬入口１７ａから搬出口１７ｂに向かう第１の方向にのみ搬送される。【選択図】図１