LIGHT EMITTING DEVICE

To provide a light emitting device in which a light emitting element and a substrate are securely bonded and which has high operational stability.SOLUTION: A light emitting device 10 includes: a substrate 11; a light emitting element 20 disposed on the substrate via a bonding layer 12; and a resin b...

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Bibliographic Details
Main Authors NIHEI NORIKO, IDE TOSHIYA, LIANG JI-HAO, KOIKE KYOTARO
Format Patent
LanguageEnglish
Japanese
Published 22.07.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a light emitting device in which a light emitting element and a substrate are securely bonded and which has high operational stability.SOLUTION: A light emitting device 10 includes: a substrate 11; a light emitting element 20 disposed on the substrate via a bonding layer 12; and a resin body 40 having a bottom surface S22 having a curved shape or a planar shape in which a side surface of the light emitting element is annularly covered, and a distance to the substrate increases with a distance from the side surface of the light emitting element.SELECTED DRAWING: Figure 1A 【課題】発光素子と基板とが確実に接合され、高い動作安定性を有する発光装置を提供する。【解決手段】発光装置１０は、基板１１と、接合層１２を介して基板上に配された発光素子２０と、発光素子の側面を環状に覆い、基板に面しかつ発光素子の側面から離れるに従って基板との距離が大きくなる曲面形状又は平面形状の底面Ｓ２２を有する樹脂体４０と、を有する。【選択図】図１Ａ
Bibliography:Application Number: JP20180001196